flame retardant in for electronics, circuit board, linear polyester, polyamide, epoxy resin, polyurethane.
DOPO.
DOP
9, 10-dihydro-9-oxa-10-phosphahenanthrene-10-oxide(DOPO)
Abbreviation: DOPO
CAS NO: 35948-25-5
Chemical Formula: C12H9O2P
Specification:
Item
Index
Appearance
White crystal or powder
purity
≥99 %
content
≥14.0%
Melting point
≥114°C
Application
: DOPO contains a rigid phosphorus group and thus provide better thermal
and flameretardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A.
The advanced epoxy resins are suitable for making a fiber-reinforced
epoxy resin
composite
which
is useful in the fabrication of printed circuit boards.
The cured
epoxy resins can be used in semiconductor encapsulation applications.
Packing
:25kg/bag
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